摘要 : Bottom-up filling of copper for different sub-micrometer trenches was investigated by electroless deposition technique using Janus Green B (JGB) and Triblock copolymers RPE-2520. The bottom-up copper filling usually achieves a rel... 展开 Bottom-up filling of copper for different sub-micrometer trenches was investigated by electroless deposition technique using Janus Green B (JGB) and Triblock copolymers RPE-2520. The bottom-up copper filling usually achieves a relative high deposition rate of copper in the bottom of trenches through inhibiting the surface deposition or accelerating the bottom deposition of copper. The bottom-up filling behavior of electroless copper deposition for different trenches was investigated in a plating bath containing 0.3 mg/L JGB and 1.0 mg/L RPE-2520. The cross-section image with SEM indicated that the trenches with different widths ranging from 110 to 520 nm were completely filled with electroless copper and that no void was found. 收起