摘要 : The effect of polyethylene glycol (PEG) molecular weight (Mw) upon the microhole filling by Cu electrodeposition was investigated by cross-sectional images using optical microscopy. The bottom-up filling capability of the electrop... 展开
作者 | L. Yin Z. H. Liu Z. P. Yang Z. L. Wang S. Shingubara |
---|---|
作者单位 | |
期刊名称 | 《Transactions of the Institute of Metal Finishing: The International Journal for Surface Engineering and Coatings》 |
总页数 | 5 |
语种/中图分类号 | 英语 / TF TG17 |
关键词 | Cu electrodeposition PEG Molecular weight Microhole Bottom-up filling |
馆藏号 | N2008EPST0008358 |