摘要 : A three-additive combination of an accelerator, a polymeric suppressor, and an organic leveler is typically utilized in the electrodeposition process to achieve Cu bottom-up filling of microvias on printed circuit boards. The use ... 展开
作者 | Lee~ Myung Hyun Kim~ Myung Jun Kim~ Jae Jeong |
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作者单位 | |
期刊名称 | 《Electrochimica Acta》 |
总页数 | 8 |
语种/中图分类号 | 英语 / TQ15 O64 |
关键词 | Cu electrodeposition Bottom-up filling Bromide ion Inorganic leveler Microvia |
馆藏号 | N2008EPST0003775 |