摘要 : A modification of the conventional Damascene metallization process is described whereby selective removal of the thin wetting/seed layer from the sidewalls and free surfaces enables selective nucleation and bottom-up electrodeposi... 展开
作者 | Chang Hwa Lee Thomas P. Moffat |
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作者单位 | |
期刊名称 | 《Electrochimica Acta》 |
总页数 | 5 |
语种/中图分类号 | 英语 / TQ15 O64 |
关键词 | Damascene process Nickel Superconformal deposition Bottom-up filling Mercaptobenzimidazole |
馆藏号 | N2008EPST0003775 |