摘要: Silicon interconnect fabric (Si-IF) is a heterogeneous integration platform for ultra-large systems. Unpackaged dies are attached directly to a Si wafer at fine vertical interconnect pitch (2 to 10 μm) and small inter-die spacing ... 展开
作者 | Boris Vaisband Subramanian S. Iyer | ||
---|---|---|---|
作者单位 | |||
文集名称 | 2019 ACM/IEEE International Workshop on System Level Interconnect Prediction | ||
出版年 | 2019 | ||
会议名称 | ACM/IEEE International Workshop on System Level Interconnect Prediction | ||
页码 | 1-6 | 开始页/总页数 | 1 / 6 |
会议地点 | Las Vegas(US) | 会议年 | 2019 |
关键词 | Integrated circuit interconnections Global communication Repeaters Fabrics Packaging System-on-chip Silicon | ||
馆藏号 | IEL27458 (8771325) |