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    摘要 : This paper presents the SPIN micro-network that is a generic, scalable interconnect architecture for system on chip. The SPIN architecture relies on packet switching and point-to-point bi-directional links between the routers impl... 展开

    摘要 : This paper presents the SPIN micro-network that is a generic, scalable interconnect architecture for system on chip. The SPIN architecture relies on packet switching and point-to-point bi-directional links between the routers impl... 展开

    摘要 : This paper presents the SPIN micro-network that is a generic, scalable interconnect architecture for system on chip. The SPIN architecture relies on packet switching and point-to-point bi-directional links between the routers impl... 展开

    [会议]   Boping Wu        China Semiconductor Technology International Conference        2019年      共 3 页
    摘要 : In this paper, we discuss a chip-package integration and miniaturization for managing high power supply demand of microprocessor. To deliver the high performance system with granular features, significant improvement of physical d... 展开

    [会议]   Boping Wu        China Semiconductor Technology International Conference        2019年      共 3 页
    摘要 : In this paper, we discuss a chip-package integration and miniaturization for managing high power supply demand of microprocessor. To deliver the high performance system with granular features, significant improvement of physical d... 展开

    [会议]   Ari Kulmala   Erno Salminen   Timo D. Hamalainen        NORCHIP Conference        2006年      共 4 页
    摘要 : The communication is predicted to pass the computation as the limiting factor of performance of complex digital circuits. The most common communication medium is a shared bus. The contemporary buses have evolved as the requirement... 展开

    [会议]   Fujiwara, Ikki   Koibuchi, Michihiro   Matsutani, Hiroki        IEEE International Symposium on Embedded Multicore Socs        2013年7th届      共 6 页
    摘要 : Chip MultiProcessors (CMPs) will have dark silicon or frequently deactivated areas in a chip, as technology continues to scale down, due to power dissipation. In this work we estimate the influences of deactivated cores on perform... 展开

    [会议]   Fujiwara, Ikki   Koibuchi, Michihiro   Matsutani, Hiroki        IEEE International Symposium on Embedded Multicore Socs        2013年7th届      共 6 页
    摘要 : Chip MultiProcessors (CMPs) will have dark silicon or frequently deactivated areas in a chip, as technology continues to scale down, due to power dissipation. In this work we estimate the influences of deactivated cores on perform... 展开
    关键词 : Network-on-Chip   darksilicon   systems on chip    

    [会议]   Cesar Albenes Zeferino   Marcio Eduardo Kreutz   Altamiro Amadeu Susin               2004年1st, 2009届      共 6 页
    摘要 : The building block of a Network-on-Chip (NoCs) is its router. It is responsible to switch the channels which forward the messages exchanged by the cores attached to the NoC, and the costs and performance of the NoC strongly depend... 展开

    [会议]   Rudy Beraha   Isask'har Walter   Israel Cidon   Avinoam Kolodny               2010年      共 6 页
    摘要 : In this paper, we examine the design process of a Network on-Chip (NoC) for a high-end commercial System on-Chip (SoC) application. We present several design choices and focus on the power optimization of the NoC while achieving t... 展开

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