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We present architecture, process design and results from test pixels of a new Active Pixel Sensor (APS) imager implemented in 0.8 um SOI-CMOS technology.
摘要 :
Feature-based imaging spectroscopy methods are effective for identifying materials that exhibit specific well-defined spectral absorption features. As long as a pixel contains a sufficient amount of material so that the absorption...
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Feature-based imaging spectroscopy methods are effective for identifying materials that exhibit specific well-defined spectral absorption features. As long as a pixel contains a sufficient amount of material so that the absorption retains its predominant shape, a feature-based method can work well. However, there are occasions when a background material can mix with a material of interest, and significantly distort and maybe even remove the absorption. In such cases, the material identification capabilities of these methods are likely to be degraded. This effort proposes an approach to accommodate these conditions. The parameter values to determine fit of an absorption feature are selected to be more tolerant of distortions and the signal contributions of any detected sub-pixel backgrounds are removed by making use of a physically-constrained linear mixing model. This mixing model is used to remove any detected background spectra from the image spectra within the bounding locations of the spectral features. However, an expected consequence of loosening the parameter values and performing sub-pixel subtraction is an increase in false alarms. A statistically-based spectral matched filter is proposed as to reduce these false alarms. We test the individual and combined approaches for identifying full-pixel and sub-pixel Tyvek panels in an experiment using a HyMAP hyperspectral scene with ground truth collected over Waimanalo Bay, Oahu, Hawaii.
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摘要 :
This paper describes the technology, design features and reliability characterization methodology of a CMOS Active Pixel Sensor. Both overall chip reliability and pixel reliability are projected for the imagers.
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The topic of this study is to compare the ATLAS specifications for the pixelsystem with the experimental specifications of the Omega3/LHC1 pixel detector. Chapter 1 is an introduction into particle physics and provides a descripti...
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The topic of this study is to compare the ATLAS specifications for the pixelsystem with the experimental specifications of the Omega3/LHC1 pixel detector. Chapter 1 is an introduction into particle physics and provides a description of the ATLAS detector. In chapter 2 the principle of Silicon as a detector material is described. Chapter 3 reviews the general features of silicon pixel detectors and the specific features of the Omega3/LHC1 detector. Chapter 4 concentrates on the measurements carried out with the NIKHEF test set up. Chapter 5 presents the measurements performed in the CERN SPS H6 test beam. Finally the conclusions of the measurements on the Omega3/LHC1 detector are presented in chapter 6.
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摘要 :
PHENIX is the largest of the four experiments currently taking data at the Relativistic Heavy Ion Collider (RHIC), and the iFVTX is a new pixel tracker which will be installed in the forward tracker region of PHENIX. Fermilab has ...
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PHENIX is the largest of the four experiments currently taking data at the Relativistic Heavy Ion Collider (RHIC), and the iFVTX is a new pixel tracker which will be installed in the forward tracker region of PHENIX. Fermilab has developed a complete test stand system for the examination of FPix2.1 modules, hybrids, and pixel chips that will be installed in the iFVTX. The system is currently in use for chip, module, and wafer testing at Fermilab. The test stand architecture is flexible and can be adapted to new requirements. In this paper, the software and hardware integration will be discussed followed by an analysis of the advantages of choosing a modular approach for the system. Finally, a selection of tests supported by the system, along with sample results, will be presented and explained.
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