摘要: In this paper, novel low loss, wide-band coplanar stripline technology for RF/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-gl... 展开
作者 | Goverdhanam, K. Simons, R. N. Katehi, L. P. B. | ||
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原报告号 | N20010071253 | 总页数 | 8 |
主办者 | National Aeronautics and Space Administration | ||
报告分类号 | [49 - Electrotechnology] | ||
报告类别/文献类型 | NASA / NTIS科技报告 | ||
关键词 | Meetings Microwave circuits Planar structures Integrated circuits Phase shift Broadband Electrical resistivity Radio frequencies Waveguides Silicon Spin glass |