摘要: This report presents reliability prediction models for printed wiring assemblies, solderless wrap assemblies, wrapped and soldered assemblies, and discrete wiring assemblies w/electroless deposited PTH for inclusion in MIL-HDBK-21... 展开 This report presents reliability prediction models for printed wiring assemblies, solderless wrap assemblies, wrapped and soldered assemblies, and discrete wiring assemblies w/electroless deposited PTH for inclusion in MIL-HDBK-217. Collected field failure rate data were utilized to develop and evaluate the factors. The reliability prediction models are presented in a form compatible with MIL-HDBK-217D, proposed. (Author) 收起