摘要: The visibility of X-ray tomography techniques for printed wiring assembly (PWA)solder bond evaluation and several categories of electronic components has been studied. The effort was performed as a final testing task assignment in... 展开
作者 | Bossi, R. H. Kruse, R. J. | ||
---|---|---|---|
原报告号 | AD-A234748 | 总页数 | 86 |
报告类别/文献类型 | AD / NTIS科技报告 | ||
关键词 | Tomography Assembly Bonding Computerized tomography Electrical equipment Electronic equipment Failure Inspection Manufacturing Optical properties Printed circuits Radiography Real time Soldering Test and evaluation Throughput Tools Transd |