摘要: Interposer-based packaging is becoming a widespread methodology for tightly integrating multiple heterogeneous dies into a single package, with the potential to improve manufacturing yield and build larger-than-reticle-sized syste... 展开 Interposer-based packaging is becoming a widespread methodology for tightly integrating multiple heterogeneous dies into a single package, with the potential to improve manufacturing yield and build larger-than-reticle-sized systems. However, interposer integration also introduces possible communication bottlenecks and cost overheads that can outweigh these benefits. To avoid these drawbacks, the abundant interposer interconnect can be leveraged as network-on-chip interconnection fabric to provide high-bandwidth, low-latency communication between chiplets and memory stacks. This work investigates this new interposer design space of passive and active interposer technologies, network-on-chip topologies, and clocking schemes to determine the cost-optimal interposer architectures for a range of performance requirements. 收起