摘要 :
Crosstalk is one of the root causes to violate jitter compliance in high speed serial link, as the data rate increase and signal density goes up. To minimize cancellation or crosstalk impact, many techniques have been investigated...
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Crosstalk is one of the root causes to violate jitter compliance in high speed serial link, as the data rate increase and signal density goes up. To minimize cancellation or crosstalk impact, many techniques have been investigated. However, unlike horizontal crosstalk, crosstalk at vertical interconnection has limitation to eliminate. In particular, coupling occurs at the interface of chip and PCB is one of the unavoidable sources of crosstalk. Among three coupling types, TX to TX, RX to RX and TX to RX, TX to RX coupling is detrimental compared to others since the aggressor TX swing is large with high slew rate and the victim RX signal has low swing and slow edge. RX jitter performance is more sensitive to noise coupling. Therefore, it is important to investigate crosstalk impact on RX performance on the system level including IOs, package and PCB. In this paper, the impact of transmitter to receiver crosstalk induced at package balls and PCB vias is characterized. Critical factors causing this near-end crosstalk are identified and analyzed. Additionally, the PCB via pattern is proposed to minimize field interference between TX and RX as simply rotating TX via pair perpendicularly to RX via pair. It is demonstrated that the proposed structure reduces crosstalk significantly.
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摘要 :
As data rate increases, crosstalk becomes a significant source of high jitter. Although many techniques have been investigated to reduce crosstalk, it is not possible to fully eliminate coupling. In particular, near-end coupling b...
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As data rate increases, crosstalk becomes a significant source of high jitter. Although many techniques have been investigated to reduce crosstalk, it is not possible to fully eliminate coupling. In particular, near-end coupling between transmitter (TX) to receiver (RX) occurs at the interface of chip and PCB is one of the main sources of crosstalk. This TX to RX coupling is detrimental compared to other TX to TX or RX to TX coupling since the aggressor TX swing is large and the victim RX signal has slow edge. Thus, RX jitter is sensitive to coupling noise from TX. Therefore, it is important to investigate crosstalk impact on receiver performance on the system level including transmitter, receiver, package and PCB. In this paper, the impact of transmitter to receiver crosstalk induced at package balls and PCB vias is characterized using the internal eye-monitoring circuits. Critical factors causing this near-end crosstalk are identified and analyzed.
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摘要 :
As data rate increases, crosstalk becomes a significant source of high jitter. Although many techniques have been investigated to reduce crosstalk, it is not possible to fully eliminate coupling. In particular, near-end coupling b...
展开
As data rate increases, crosstalk becomes a significant source of high jitter. Although many techniques have been investigated to reduce crosstalk, it is not possible to fully eliminate coupling. In particular, near-end coupling between transmitter (TX) to receiver (RX) occurs at the interface of chip and PCB is one of the main sources of crosstalk. This TX to RX coupling is detrimental compared to other TX to TX or RX to TX coupling since the aggressor TX swing is large and the victim RX signal has slow edge. Thus, RX jitter is sensitive to coupling noise from TX. Therefore, it is important to investigate crosstalk impact on receiver performance on the system level including transmitter, receiver, package and PCB. In this paper, the impact of transmitter to receiver crosstalk induced at package balls and PCB vias is characterized using the internal eye-monitoring circuits. Critical factors causing this near-end crosstalk are identified and analyzed.
收起
摘要 :
Crosstalk is one of the root causes to violate jitter compliance in high speed serial link, as the data rate increase and signal density goes up. To minimize cancellation or crosstalk impact, many techniques have been investigated...
展开
Crosstalk is one of the root causes to violate jitter compliance in high speed serial link, as the data rate increase and signal density goes up. To minimize cancellation or crosstalk impact, many techniques have been investigated. However, unlike horizontal crosstalk, crosstalk at vertical interconnection has limitation to eliminate. In particular, coupling occurs at the interface of chip and PCB is one of the unavoidable sources of crosstalk. Among three coupling types, TX to TX, RX to RX and TX to RX, TX to RX coupling is detrimental compared to others since the aggressor TX swing is large with high slew rate and the victim RX signal has low swing and slow edge. RX jitter performance is more sensitive to noise coupling. Therefore, it is important to investigate crosstalk impact on RX performance on the system level including IOs, package and PCB. In this paper, the impact of transmitter to receiver crosstalk induced at package balls and PCB vias is characterized. Critical factors causing this near-end crosstalk are identified and analyzed. Additionally, the PCB via pattern is proposed to minimize field interference between TX and RX as simply rotating TX via pair perpendicularly to RX via pair. It is demonstrated that the proposed structure reduces crosstalk significantly.
收起
摘要 :
Crosstalk is one of the root causes to violate jitter compliance in high speed serial link, as the data rate increase and signal density goes up. To minimize cancellation or crosstalk impact, many techniques have been investigated...
展开
Crosstalk is one of the root causes to violate jitter compliance in high speed serial link, as the data rate increase and signal density goes up. To minimize cancellation or crosstalk impact, many techniques have been investigated. However, unlike horizontal crosstalk, crosstalk at vertical interconnection has limitation to eliminate. In particular, coupling occurs at the interface of chip and PCB is one of the unavoidable sources of crosstalk. Among three coupling types, TX to TX, RX to RX and TX to RX, TX to RX coupling is detrimental compared to others since the aggressor TX swing is large with high slew rate and the victim RX signal has low swing and slow edge. RX jitter performance is more sensitive to noise coupling. Therefore, it is important to investigate crosstalk impact on RX performance on the system level including IOs, package and PCB. In this paper, the impact of transmitter to receiver crosstalk induced at package balls and PCB vias is characterized. Critical factors causing this near-end crosstalk are identified and analyzed. Additionally, the PCB via pattern is proposed to minimize field interference between TX and RX as simply rotating TX via pair perpendicularly to RX via pair. It is demonstrated that the proposed structure reduces crosstalk significantly.
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摘要 :
With its long operating range and ability to be used in a turbid environment, sonar sensor is mainly used to explore underwater environment. As a result, many algorithms based on the sonar have been developed. However, in the case...
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With its long operating range and ability to be used in a turbid environment, sonar sensor is mainly used to explore underwater environment. As a result, many algorithms based on the sonar have been developed. However, in the case of a multi-beam sonar, its mechanism causes crosstalk noise around the underwater object, which degrades the accuracy of these algorithms. In this paper, we propose a method to remove crosstalk noise from a sonar image by detecting the region where the crosstalk noise occurred using a convolutional neural network and filling the detected region with adjacent pixel values. The proposed method could accurately and effectively detect and remove crosstalk noise in a given sonar image. Therefore, the accuracy of the sonar-based algorithms such as a 3-D reconstruction of underwater terrain can be improved.
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摘要 :
Aggressive scaling has led to signal integrity and performance issues in today's copper based interconnects. This paper presents an analytical model for delay and crosstalk in the copper based nanointerconnect systems. The propose...
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Aggressive scaling has led to signal integrity and performance issues in today's copper based interconnects. This paper presents an analytical model for delay and crosstalk in the copper based nanointerconnect systems. The proposed model is compared with SPICE and it is found that the proposed model is almost 100% accurate as SPICE and in an average ∼70 times faster than SPICE. Using the proposed analytical model, the crosstalk delay and noise are estimated in copper based nanointerconnects for various submicrometer technology nodes (i.e. 45nm, 32nm, 22nm and 16nm) and interconnect lengths of 100μm, 500μm, 1mm, 5mm and 10mm respectively.
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摘要 :
Aggressive scaling has led to signal integrity and performance issues in today's copper based interconnects. This paper presents an analytical model for delay and crosstalk in the copper based nanointerconnect systems. The propose...
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Aggressive scaling has led to signal integrity and performance issues in today's copper based interconnects. This paper presents an analytical model for delay and crosstalk in the copper based nanointerconnect systems. The proposed model is compared with SPICE and it is found that the proposed model is almost 100% accurate as SPICE and in an average ∼70 times faster than SPICE. Using the proposed analytical model, the crosstalk delay and noise are estimated in copper based nanointerconnects for various submicrometer technology nodes (i.e. 45nm, 32nm, 22nm and 16nm) and interconnect lengths of 100μm, 500μm, 1mm, 5mm and 10mm respectively.
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摘要 :
Aggressive scaling has led to signal integrity and performance issues in today's copper based interconnects. This paper presents an analytical model for delay and crosstalk in the copper based nanointerconnect systems. The propose...
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Aggressive scaling has led to signal integrity and performance issues in today's copper based interconnects. This paper presents an analytical model for delay and crosstalk in the copper based nanointerconnect systems. The proposed model is compared with SPICE and it is found that the proposed model is almost 100% accurate as SPICE and in an average ~70 times faster than SPICE. Using the proposed analytical model, the crosstalk delay and noise are estimated in copper based nanointerconnects for various submicrometer technology nodes (i.e. 45nm, 32nm, 22nm and 16nm) and interconnect lengths of l00μm, 500μm. 1mm， 5mm and 10mm respectively.
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摘要 :
The goal of this paper is to describe some of the design choices made in a BladeCenter system design. This paper will focus on the connector modeling that was used to make design trade-offs, unique to a 10 Gbps serial system. Conn...
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The goal of this paper is to describe some of the design choices made in a BladeCenter system design. This paper will focus on the connector modeling that was used to make design trade-offs, unique to a 10 Gbps serial system. Connectors are a significant source of crosstalk noise in a system, which could increase jitter in the resulting eye pattern. Since crosstalk jitter is uncorrelated from the link data pattern, it is hard to remove through equalization techniques. This paper provides a process to extract accurate coupled models from connectors. It also describes how modeling was used to predict crosstalk noise and shows how a small percentage of connector crosstalk can have a significant impact on the over all signal distortion, if the connector pin assignment is done randomly.
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