摘要: The ATT/Rockwell team met all the objectives of this collaborative program; ATT supplied the QWIP detector arrays and Rockwell subsequently fabricated hybrid focal plane arrays using available high performance CMOS multiplexers, t... 展开 The ATT/Rockwell team met all the objectives of this collaborative program; ATT supplied the QWIP detector arrays and Rockwell subsequently fabricated hybrid focal plane arrays using available high performance CMOS multiplexers, tested the hybrids, performed breadboard imaging demonstrations and delivered several hybrid FPAs. Eighteen hybrids were fabricated and evaluated. The collaboration yielded significant improvements in QWIP FPA performance and reliability and many milestones including: first BLIP LWIR FPA sensitivity demonstration at low photon backgrounds (< 1 x 10 to the 12th photons/sq cm-sec) with the GaAs-based quantum well infrared photodetector (QWIP) technology, high LWIR FPA pixel operability. NE Delta T's as low as 5 mK at LWIR imaging backgrounds at f/1.4 and temperatures consistent with mechanical coolers (approx. 65K), increased coupling efficiency by over an order of magnitude; achieved effective quantum efficiency of approx. 10% with low crosstalk. effective quantum efficiencies of up to 30% under flood illumination, though with high crosstalk, mean D* of 1 x 10 to the 14th cm-Hz to the 1/2/w at 3.0 x 10 to the 9th photons/sq cm-sec background at 32.5K operating temperature with > 98% operability. maximum temperature for 9.5 microns m FPA BLIP sensitivity as high as 62K, excellent hybrid reliability by mechanically thinning the QWIP, responsivity nonuniformity < 3% rms, thus enabling >83 dB dynamic range. 收起