摘要: Three-dimensional (3D) integration is considered as a solution to overcome capacity, bandwidth, and performance limitations of memories. However, due to thermal challenges and cost issues, industry embraced 2.5D implementation for... 展开
作者 | Itir Akgun Jia Zhan Yuangang Wang Yuan Xie | ||
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作者单位 | |||
文集名称 | Proceedings of the 34th IEEE International conference on computer design | ||
出版年 | 2016 | ||
会议名称 | International conference on computer design | ||
页码 | 33-40 | 开始页/总页数 | 00000033 / 8 |
会议地点 | Scottsdale(US) | 会议年/会议届次 | 2016 / 34th |
关键词 | Silicon Bandwidth Three-dimensional displays Network topology Topology Memory management Routing | ||
馆藏号 | IEL23835 (7753252) |