[机翻] 碳纳米管通过硅互连线传输特性的研究
    [期刊]
  • 《Microwave and Wireless Components Letters, IEEE》 2014年24卷12期

摘要 : In this letter, the Resistance Inductance Capacitance Conductance (RLCG) parameters of carbon nanotube through silicon via (CNT-TSV) are modeled and a transmission line (TL) model is established through ABCD matrix. The impact of ... 展开

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