摘要 : Alongside innovative device, circuit, and microarchitecture level techniques to alleviate power and thermal problems in nanoscale CMOS-based integrated circuits (ICs), chip cooling could be an effective knob for power and thermal ... 展开
作者 | Lin~ S.-C. Banerjee~ K. |
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期刊名称 | 《IEEE Transactions on Electron Devices》 |
页码/总页数 | p.245-255 / 11 |
语种/中图分类号 | 英语 / TM10 TN |
关键词 | Cooling integrated circuits performance power consumption thermal management |
DOI | 10.1109/TED.2007.911763 |
馆藏号 | IELEP0099 |