摘要 : A full 3-dimensional (3D) conjugate heat transfer model has been developed to simulate the heat transfer performance of silicon-based, parallel microchannel heat sinks. A semi-normalized 3-dimensional heat transfer model has been ... 展开
作者 | J. Li G.P. Peterson |
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作者单位 | |
期刊名称 | 《International Journal of Heat and Mass Transfer》 |
页码/总页数 | p.2895-2904 / 10 |
语种/中图分类号 | 英语 / TK12 O551 |
关键词 | microchannel numerical simulation heat transfer optimization microelectronic cooling |
馆藏号 | TK-049 |