摘要 : Introduces a new method for fabricating capacitive micromachined ultrasonic transducers (CMUTs) that uses a wafer bonding technique. The transducer membrane and cavity are defined on an SOI (silicon-on-insulator) wafer and on a pr... 展开
作者 | Yongli Huang Ergun~ A.S. Haeggstrom~ E. Badi~ M.H. Khuri-Yakub~ B.T. |
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作者单位 | |
期刊名称 | 《Journal of Microelectromechanical Systems》 |
页码/总页数 | p.128-137 / 10 |
语种/中图分类号 | 英语 / TN |
关键词 | microsensors capacitive sensors wafer bonding ultrasonic transducers silicon-on-insulator capacitive micromachined ultrasonic transducers wafer-bonding technology CMUTs transducer membrane SOI vacuum-sealed cavity vacuum chamber device tu |
DOI | 10.1109/JMEMS.2003.809968 |
馆藏号 | IELEP0163 |