摘要 : The paste printing process accounts for the majority of assembly defects, and most defects originate from poor understanding of the effect of printing process parameters on the printing performance. As the current product miniatur... 展开
作者 | R. Durairaj T. A. Nguty N. N. Ekere |
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作者单位 | |
期刊名称 | 《Soldering & Surface Mount Technology》 |
总页数 | 5 |
语种/中图分类号 | 英语 / TG40 |
关键词 | Solder paste Stencil printer Viscosity Pastes |
馆藏号 | N2008EPST0010641 |