国际刊号：
0018-9219
出版周期：
Monthly
| 序号 | 标题 | 作者 | 起始页 | 操作 |
|---|---|---|---|---|
| 1 | Front Cover | |||
| 2 | Proceedings of the IEEE Publication Information | |||
| 3 | IEEE Membership | |||
| 4 | Proceedings of the IEEE: Stay Informed. Become Inspired | |||
| 5 | Table of Contents | 401 | ||
| 6 | In-Band Full Duplex | Ashutosh Sabharwal, Besma Smida | 402 | |
| 7 | Doubling Down on Wireless Capacity: A Review of Integrated Circuits, Systems, and Networks for Full Duplex | Aravind Nagulu, Negar Reiskarimian, Tingjun Chen... | 405 | |
| 8 | In-Band Full-Duplex: The Physical Layer | Besma Smida, Risto Wichman, Kenneth E. Kolodziej... | 433 | |
| 9 | A State-of-the-Art Survey on Full-Duplex Network Design | Yonghwi Kim, Hyung-Joo Moon, Hanju Yoo... | 463 | |
| 10 | Subband Full-Duplex Large-Scale Deployed Network Designs and Tradeoffs | Muhammad Abdelghaffar, Thomas Valerrian Pasca Santhappan, Yeliz Tokgoz... | 487 |
