摘要: Three dimension Multi processors System-on-Chip (3D-MPSoCs) hold promises to allow the development of compact and efficient devices. They support many applications on the same die, able of being mapped dynamically during the execu... 展开
作者 | Johanna Sepúlveda Guy Gogniat Ricardo Pires Cesar Pedraza Wang Chau Marius Strum | ||
---|---|---|---|
作者单位 | |||
文集名称 | 2013 IEEE 4th Latin American symposium on circuits and systems | ||
出版年 | 2013 | ||
出版社/出版地 | Institute of Electrical and Electronics Engineers / Piscataway | ||
会议名称 | IEEE Latin American Symposium on Circuits and Systems | ||
开始页/总页数 | 157 / 4 | ||
会议日期/会议地点 | 20130227-0301 / Cusco | 会议年/会议届次 | 2013 / 4th |
中图分类号 | TP27-53 | ||
关键词 | 3D-MPSoCs 3D-NoC. 3D-CS | ||
馆藏号 | N2013111400002545 |