摘要 : Microdevices are fractured at specific sites to fabricate free-standing multilayered submicrometer structures, which consist of the microdevice cross sections that become exposed after fracture. As determined by finite-element mod... 展开 Microdevices are fractured at specific sites to fabricate free-standing multilayered submicrometer structures, which consist of the microdevice cross sections that become exposed after fracture. As determined by finite-element modeling, the microdevices feature a fracturing point where stress concentrates under applied pulling forces. The structures fabricated here have a core of phosphosilicate glass surrounded by a layer of polycrystalline silicon. 收起