摘要: This presentation provides an overview of the NEPP Program.
| 作者 | Label, K. A. Sampson, M. J. | ||
|---|---|---|---|
| 原报告号 | N160012699 | 总页数 | 24 |
| 主办者 | National Aeronautics and Space Administration | ||
| 报告分类号 | [49 - Electrotechnology] | ||
| 报告类别/文献类型 | NASA / NTIS科技报告 | ||
| 关键词 | Printed circuits Aerospace industry Circuit boards Electronic packaging Integrated circuits Electromechanics Chips Capacitors Resistors Quality control Industries | ||
