摘要: Over the years, many analytical and experimental research studies have aimed to improve the state-of-the-art assessment of solder joint integrity from a physics-of-failure perspective. Although much progress has been made, there... 展开 Over the years, many analytical and experimental research studies have aimed to improve the state-of-the-art assessment of solder joint integrity from a physics-of-failure perspective. Although much progress has been made, there still exist many inconsistent and even contradictory correlations and conclusions. Before discussing some of the prominent inconsistencies found in the literature, this paper reviews the fundamental physics underlying the nature of solder failure...Using the complex constitutive properties of solder, fundamental mechanical and thermomechanical proccesses can be modeled to demonstrate some of the inconsistencies in the literature. 收起