摘要: A 472 dimpled ball grid array (D-BGA) package has not been used in past space flight environments, therefore it was necessary to develop a process that would yield robust and reliable solder joints. The process developing assemb... 展开
作者 | Barr, S. L. Mehta, A. | ||
---|---|---|---|
原报告号 | 20060033765 | 总页数 | 19 |
报告类别/文献类型 | NASA / NTIS科技报告 | ||
关键词 | ENVIRONMENTAL TESTS INSPECTION SOLDERS solder joints |