摘要: Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
作者 | Ghaffarian, R. | ||
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原报告号 | 20060034017 | 总页数 | 5 |
报告类别/文献类型 | NASA / NTIS科技报告 | ||
关键词 | CHIPS RELIABILITY SOLDERS CSP Solder Joint Reliability |