摘要: Three techniques, ultrasonic, laser/IR and video were evaluated for feasibility as solder joint defect detectors. All three were found to be feasible with a combined detection accuracy of approximately 90 percent for 19 types of d... 展开 Three techniques, ultrasonic, laser/IR and video were evaluated for feasibility as solder joint defect detectors. All three were found to be feasible with a combined detection accuracy of approximately 90 percent for 19 types of defects. Detection of severe defects is near 100 percent. All three techniques should be continued for development under Phase 2 to the extent of fabricating use-size models of equipment to use the three techniques. (Author) 收起