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Process Development and Optimization of via Laser Drilling and Cu Electroplating for Through-Wafer Vias (TWVs) in Silicon-Interconnect Fabric (Si-IF)

[学位论文]

Yakkaluru, Dharani Jaya.
University of California Los Angeles.

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ISBN	9798379545048
作者	Yakkaluru, Dharani Jaya.	授予学位单位	University of California Los Angeles.
导师	Iyer, Subramanian Srikanteswara	学位	M.S.
学科	Materials science. Optics.	国籍	US
页码/总页数	75 p. / 75	出版年	2023
中图分类号	TB3, O43
关键词	Substrate 3D integration Packaging systems High-Bandwidth Memory

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