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The Effects of SnAgCu Solder Interconnect Package’s Parameters on Electromigration Failure Mechanisms

[学位论文]

Kim, Yi Ram.
The University of Texas at Arlington.

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ISBN	9798790651526
作者	Kim, Yi Ram.	授予学位单位	The University of Texas at Arlington.
导师	Kim, Choong-Un	学位	Ph.D.
学科	Engineering. Materials science.	国籍	US
页码/总页数	122 p. / 122	出版年	2021
中图分类号	TB3, TB1
关键词	Electromigration Failure mechanism Wafer-level chip scale package Pulsed direct current Alternating current UBM thickness Sn grain orientation Substrate effect

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