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Localized adsorption of organic additives during copper electrodeposition.

[学位论文]

Chung, Dean S.
University of Illinois at Urbana-Champaign.

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ISBN	9780591197
作者	Chung, Dean S.	授予学位单位	University of Illinois at Urbana-Champaign.
导师	Alkire, Richard C.,	学位	Ph.D.
学科	Engineering Chemical. Engineering Materials Science.	国籍	US
页码/总页数	118 p. / 118	出版年	1996
中图分类号	TQ02, TB3
关键词	fluorescence gold plating surface morphology

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