| 作者 | Huang, Xingjia. | 授予学位单位 | Hong Kong University of Science and Technology (People's Republic of China). |
|---|---|---|---|
| 导师 | Lee, S.-W. Ricky, | 学位 | Ph.D. |
| 学科 | Engineering Packaging. Engineering Materials Science. Engineering Mechanical. | 国籍 | CN |
| 页码/总页数 | 185 p. / 185 | 出版年 | 2003 |
| 中图分类号 | TH, TB48, TB3 | ||
| 关键词 | Eutectic Flip-chip packages Lead-free solders Plastic ball grid Shear strength Solder | ||
