[机翻] 机械应力对低k$SiOC介质双大马士革电容器电子输运的影响
    [期刊]
  • 《IEEE Electron Device Letters》 2013年34卷8期

摘要 : The electronic package with lead-free welding processes must be performed at higher temperature whereas the heat induces to mechanical stress. In this letter, we fabricate a low-<formula formulatype="inline"><tex Notation="TeX">$k... 展开

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